• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method for producing a printed circuit board having at least one cavity for receiving an electronic component, the cavity walls having a reflective, in particular reflecting reflector layer, is characterized by the following steps: providing a printed circuit board (1), applying a temporary protective layer (7) on at least a portion of the surface of the circuit board (1), producing the cavity (9) while penetrating the protective layer (7) in the region of the cavity (9), applying the reflector layer (11), removing the temporary protective layer (7).
    公开号:AT515372A1
    申请号:T50058/2014
    申请日:2014-01-29
    公开日:2015-08-15
    发明作者:
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    Method for producing a printed circuit board
    The present invention relates to a method for producing a printed circuit board having at least one cavity for receiving an electronic component, the cavity walls having a reflective, in particular reflecting, reflector layer and a printed circuit board produced by this method.
    Printed circuit boards are used in the electronic industry for the highly integrated interconnection of electronic components in the smallest of spaces. In addition to the mechanical support function, printed circuit boards must fulfill a number of other functions due to the high level of integration necessary to meet the requirements of miniaturization of electronic equipment. For example, the heat distribution in the circuit board or the dissipation of heat from the circuit board is given great attention. Many applications use powerful LED components, so-called PowerLEDs, which are increasingly being integrated into cavities in the printed circuit board itself. The integration of an LED in the PCB allows a good dissipation of the heat generated by the LED in the circuit board, where an efficient distribution of heat can be done to avoid heat damage in the area of the LED as possible. The disadvantage here, however, that walls by the spatial enclosure of the LED through the walls, the efficiency of the LED is reduced in terms of light output.
    It would thus be desirable to provide the cavities or the cavity walls for LED applications with a highly reflective and in particular specular reflector layer. However, the problem here is that all the methods to be considered for forming such reflector layers in the context of industrial production of printed circuit boards result in a more or less unspecific application of the reflector layer-forming materials, e.g. Paints, pigments and / or metals, lead to the circuit board. For example, paints and pigments are sprayed on, so that at least the areas surrounding the cavities are soiled with the paint. This is particularly problematic for printed circuit boards for LED applications, as LED chips are typically contacted by wire bonding techniques which require special surface treatment of the printed circuit board to provide appropriate bond surfaces. On the one hand, these bonding surfaces must remain free of contamination or even superimposition by other layers for the bonding of the components, and on the other hand are mechanically very sensitive, so that these surfaces should remain largely untouched after their production.
    The invention is therefore based on the object of specifying a method which makes it possible to selectively apply reflector layers to the cavity walls, without damaging conductor track structures and, in particular, bonding surfaces.
    This object is achieved by a method of the type mentioned, which is characterized by the following steps:
    Providing a printed circuit board,
    Applying a temporary protective layer to at least a portion of the surface of the circuit board,
    Producing the cavity while penetrating the protective layer in the area of the cavity, applying the reflector layer Removing the temporary protective layer.
    According to the present invention, a printed circuit board is provided with a temporary protective layer prior to the production of the cavity and thus also before the mirroring of the cavity, which is intended to protect conductor tracks and, above all, sensitive bonding surfaces from soiling and damage. Since the temporary protective layer is penetrated by the corresponding tool during the production of the cavity, the temporary protective layer reaches exactly to the edge of the cavity, so that in fact only the cavity walls are coated with the reflector layer. The temporary protective layer is removed after completion of the mirrored cavities, whereby the sensitive surfaces are exposed again and thus available for further processing of the printed circuit board. As a rule, this is followed by the further processing in the form of equipping the mirrored cavities with the LED chips, which are contacted by means of wire bonding method.
    In this context, the method according to the invention is preferably further developed such that a printed circuit board with structured bonding surfaces for electronic components is provided. Although bonding surfaces for electronic components, such as LED chips, are relatively sensitive to conventional copper traces and, above all, are sensitive to mechanical stresses, they resist the application and removal of a temporary protective layer as used in the present invention should, without further notice and can be used after removing the temporary protective layer for Ankontaktieren by wire bonding method.
    As already mentioned, arise in a circuit board due to the high integration of the electronic components, all of which naturally produce a certain amount of waste heat and especially when using high-power LED chips large amounts of heat that occur very selectively especially in the aforementioned LED chips and therefore To avoid heat spikes in the circuit board must be effectively distributed to ensure an acceptable life of the circuit board. According to a preferred embodiment of the present invention, the method according to the invention is therefore preferably developed in such a way that an IMS printed circuit board is provided as the printed circuit board. The abbreviation IMS stands for Insulated Metal Substrates and designates starting materials for printed circuit boards, in which an insulating layer, for example consisting of thermally conductive particles (eg alumina, aluminum nitride) filled epoxy, between a thin metal layer to form the conductor tracks and a relatively thick metal plate is arranged which metal plate can very effectively distribute heat over the entire surface of the plate. The use of an IMS circuit board for receiving LED chips in cavities thus represents a very favorable option with regard to the distribution of heat, but when the cavity containing the LED chip is not mirrored according to the invention, a relatively low light output results. This is because the cut surfaces of the cavity, i. the cavity walls, which are usually made of aluminum or copper, have a relatively low reflectivity. This disadvantage of using an IMS printed circuit board for receiving LED chips in cavities is thus optimally compensated with the present invention, since the per se poorly reflecting or not reflecting at least cavity walls can be provided with a corresponding reflector layer, without possibly on the Conductor plate surface existing bonding surfaces during the manufacture of the reflector layer to damage.
    Since it is possible with the present invention to apply a highly efficient reflector layer on cavity walls, it is not necessary to take special measures in the production of the cavity to optimize the reflectivity of the cavity walls. According to a particularly simple and therefore preferred embodiment of the present invention, it is therefore possible in particular to proceed in such a way that the step of producing the cavity comprises milling the printed circuit board with a milling head. The milling of the circuit board with a milling head can be automated in an excellent manner, the milling head, which is able to mill the printed circuit board, and in particular an IMS printed circuit board, naturally also penetrates the temporary protective layer with ease and a clear cutting surface of the Protective layer can produce, so that an optimal limitation of the reflector layer is achieved on the cavity walls.
    However, according to a preferred alternative embodiment of the present invention, it is also possible to proceed in such a way that a printed circuit board made of a prepreg material is provided as the printed circuit board. Although such prepreg materials, such as FR4, have much lower thermal conductivity than the aforementioned IMS circuit boards, they are widely used and offer advantages over IMS circuit boards in terms of the relatively simple realizability of multilayer printed circuit board assemblies, again in the electronics industry desired miniaturization of the PCB meets. The inventors of the present inventive method have found that the method can be readily applied to such printed circuit boards of prepreg materials.
    In this case, it is preferable that the step of producing the cavity includes cutting the circuit board with a laser beam. Cutting such printed circuit boards with a laser beam is a well-established standard method in the printed circuit board industry and can be readily implemented to produce cavities. For example, prepreg printed circuit boards are cut with CO 2 lasers, wherein the penetration depth of the laser can be controlled in the circuit board by the pre see a laser stop pest of copper in the desired depth of the circuit board. Thus, the laser does not have to cut through the circuit board, but can cut to a certain depth, making the laser cutting method for forming a cavity in the sense of a cavity with a bottom in the circuit board the method of choice.
    In order to favor the formation of a cavity in such a prepreg printed circuit board, the invention according to a preferred embodiment is further developed such that the printed circuit board has an adhesion-reducing layer arranged above a laser stop pest. Now, if the laser cuts off on the laser stop pest and exempts, for example, an approximately cuboid piece of printed circuit board, this cuboid piece can be particularly easily removed from the volume of the circuit board by the action of the adhesion-reduced layer. Such adhesion-reducing layers or adhesion-reducing materials are known in printed circuit board technology and consist in particular of Al, Mg, Ca, Na or Zn soaps together with a binder and a solvent. These materials are already used by default to release printed circuit board layers that have been cut free from the underlying PCB layers. The use of an adhesion-reducing layer has become known, for example, from WO 2010/085830 A1.
    The temporary protective layer which is so important for the present invention can be applied to the printed circuit board in various ways. According to a preferred embodiment of the present invention, however, it is provided that a self-adhesive film is applied as a temporary protective layer, in which case the self-adhesive film can be laminated at only low pressure and at normal processing temperature of the printed circuit board.
    It is preferable that the self-adhesive film is a polyethylene-based film having a rubber-based adhesive layer. Such films are used inter alia as laser protective films and are known for example under the name Laserguard Light 3100H3 the company Nitto Denko. Likewise, for example, the film PF 32 C from Poli-Film falls into this category.
    According to an alternative preferred embodiment of the present invention, the self-adhesive film is a PVC-based film having an acrylate-based adhesive layer. Such films are known as surface protection films, which are characterized by excellent deformation properties and are used for the protection of metal surfaces in deformation or bending processes. In this category the film SPV 224P of the company Nitto Denko has to be mentioned, which is a PVC film with pressure-sensitive acrylate adhesive and which provides lubrication properties during milling.
    According to a further preferred embodiment of the present invention, the self-adhesive film is a polyethylene-based film with an acrylate-based adhesive layer, which includes, for example, the film PF 13 from Poli-Film.
    All of the aforementioned films are already used by default in printed circuit board processing and their handling is therefore familiar to the person skilled in the art.
    However, as an alternative to the aforementioned self-adhesive films, an embodiment of the present invention is conceivable in which a silicone-based paint is applied as a temporary protective layer, which are applied in a thicker layer and after further processing of the printed circuit board, i. after preparation of the mirrored cavities can be removed mechanically by peeling again.
    All of the aforementioned variants for providing or for applying a temporary protective layer have in common that the removal of the temporary protective layer can be done mechanically by stripping, since a chemical removal attack the reflector layer in the cavity and / or the surfaces to be protected, and in particular the bonding surfaces would.
    In order to produce the reflector layer, it is preferable to proceed in such a way that the reflector layer is formed from a lacquer selected from the group consisting of epoxy lacquers and acrylate lacquers. Epoxy and acrylate paints are similar to the solder resists known in the printed circuit board industry and may be filled with white pigments or fillers. Thus, on the one hand known white solder resists can be used, e.g. Lacquers of the company Taiyo or Huntsman (Probimer 77) or specially prepared for the formation of reflector layers. However, it is essential that the coating systems must be stable to UV light and thermal stress and must not yellow. These lacquers can be applied by means of spraying, whereby they are very finely atomized and can also cover the cavity walls easily by taught coating.
    Alternatively, the invention may be developed to the effect that the reflector layer is applied as a metal layer of the metals selected from the group consisting of Al, Ag and Rh on the circuit board. These metal layers form a mirror on the surface, whereby the incident light is reflected in a directed manner. The best reflection in the visible wavelength range is achieved with silver. For cost reasons, however, aluminum is often used, which also has acceptable reflection properties. Silver can be deposited chemically on metal layers, but is not stable in the atmosphere due to the formation of silver sulfide layers. Therefore, in the context of the present invention, silver reflector layers are generally coated with rhodium, which forms stable protective layers which, however, do not hinder the reflection of the light. The rhodium is applied galvanically.
    In order to further improve the reflection properties of the reflector layer, thin transparent oxide layers can be applied to the said metal layers. The invention is therefore preferably further developed such that additionally a layer selected from the group consisting of silicon oxide and aluminum oxide is applied. This can be done by means of physical vapor deposition in a vacuum (PVD coating, PVD = Physical Vapor Deposition).
    A particularly preferred procedure for applying a reflector layer provides that the step of applying the reflector layer comprises the following steps:
    Painting the cavity with a gloss varnish
    Applying a reflective layer of metal on the gloss varnish
    Applying a hexamethyldisiloxane-based protective layer to the reflective layer.
    Such a method is already used for the production of reflectors, for example for vehicle headlights with particularly high-quality optical surfaces and can be obtained, for example, under the trade name ALUNOVA® OTEC and implemented for the production of printed circuit boards. The gloss varnish is used to compensate for unevenness of the surface, such as the milling edge of the cavity, and to form a smooth surface and better adhesion for the subsequent
    Reflection layer, which is usually made of aluminum to create. These gloss varnish systems can be applied by spraying or by deposition in the anodic electrocoating process. The application of the highly reflective metal layer, preferably of ultrapure aluminum, is done in a vacuum by vapor deposition or magnetron sputtering. The hexamethylsiloxane-based protective layer is applied to protect the aluminum from external influences and, above all, corrosive attack and provides a long-term stable, wiping-resistant organosilicon protective layer with high chemical barrier effect. This layer is free of irrigation, almost free of pores, and has an extremely low light absorption. The hexamethyldisiloxane is deposited by deposition in a medium frequency vacuum process by plasma polymerization and produces a vitreous coating layer on the surface of the body to be coated.
    According to a preferred embodiment of the present invention, it is provided that in the step of producing the cavity is kept distance to existing conductor tracks or bonding surfaces of the circuit board, which is particularly important if the reflector layer consists of an electrically conductive material. In this case, the metallic and therefore conductive reflector layer must not come into contact with the conductor tracks or bonding surfaces of the printed circuit board, as this would lead to an electrical short circuit. If, according to this preferred embodiment, the cavity is produced at a certain distance from existing conductor surfaces or bonding surfaces of the printed circuit board in order to apply the reflector layer in the presence of the temporary protective layer, as is provided in the present inventive method, it is ensured that after removal no such short circuit is formed in the temporary protective layer, since the protective layer overlaps or projects over the conductor tracks or bonding surfaces.
    The invention is explained in more detail below with reference to an embodiment schematically illustrated in the drawing. 1a-1f show a first preferred embodiment of the method according to the invention and FIGS. 2a-2b show an alternative preferred embodiment of the method according to the invention.
    In Fig. La), a printed circuit board is designated 1, wherein the circuit board 1 in the present case, an IMS printed circuit board (Insulated Metal Substrate). The IMS circuit board 1 is characterized by a relatively thick metal substrate 2, which may be made of copper or aluminum and may have a thickness of at least 50 μιη up to a few millimeters. The substrate layer 2 is followed by an insulating layer 3, which as a rule consists of an insulating resin system filled with thermally conductive particles, for example epoxy resin. On this insulating layer 3 conductor tracks 4 and gold surfaces 5, which serve as bonding surfaces arranged. The circuit board 1 is thus ready to receive LED chips, which could be mounted, for example, at position 6, wherein the contacting of an LED chip on the bonding surfaces 5 could take place. In the context of the present invention, in which a cavity is to be produced, a temporary protective layer 7 is now applied to the printed circuit board 1 (FIG. 1b) covering the bonding surfaces 5. The temporary protective layer 7 could also cover the conductor tracks 4 made of copper, if they were not covered by gold surfaces 5 as in the present case. In Fig. Lc) it can be seen that in the preparation of FIG. Lb) circuit board, for example by means of a milling head 8, a cavity 9 can be produced. The cavity 9 has after this process step relatively poorly reflective cavity walls 10. According to Fig. Id), the reflector layer 11 is now applied, as symbolized by the bevy of arrows 12. It can be seen that the reflector layer 11 covers both the temporary protective layer 7 and the cavity walls 10 in a planar manner. After the removal of the temporary protective layer 7 (FIG. 1)), a printed circuit board with a mirrored cavity 9 is obtained, wherein the reflector layer 11 only lines the interior of the cavity 9. In the mirrored cavity 9, an LED chip 12 can now be used, which can be contacted via bonding wires 13 to the bonding surface 5 (Fig. Lf)).
    Fig. 2a again shows a printed circuit board 1 which, however, in the present case is not an IMS printed circuit board but a printed circuit board made of a well-known, glass-fiber-reinforced epoxy resin (for example FR4). The FR4 layer or prepreg layer is denoted by 14, again with copper layers 4 and bonding surfaces 5 present on the printed circuit board 1. At 15, a laser beam is symbolized, which cuts through both the protective layer 7 and through the prepreg layer 14, which is an insulating layer, until it encounters a laser stop layer 16, for example made of copper. 17 denotes an adhesion-reducing layer, which facilitates the detachment of the plug 18 cut by means of the laser beam 15 (FIG. 2b)). The state in Fig. 2b corresponds in principle to the
    State of the printed circuit board in Fig. Lc) and it is obvious that the further processing and the production of the mirrored cavity can be carried out analogously to the process steps ld) to lf), so that ultimately a populated printed circuit board as shown in Fig. 2c) can be seen.
    It will be appreciated that the present invention may not only be used in conjunction with LED chips, but may also be useful for other opto-electronic components, such as photodiodes or laser diodes, optionally together with a light conversion means.
    权利要求:
    Claims (18)
    [1]
    Claims 1. A method for producing a printed circuit board having at least one cavity for receiving an optoelectronic component, the cavity walls having a reflective, in particular reflecting, reflector layer, characterized by the following steps: providing a printed circuit board (1), bringing a temporary protective layer (7) on at least a portion of the surface of the circuit board (1), producing the cavity (9) while penetrating the protective layer (7) in the region of the cavity (9), applying the reflector layer (11), removing the temporary protective layer (7).
    [2]
    2. The method according to claim 1, characterized in that a printed circuit board (1) with structured bonding surfaces (5) for electronic components (12) is provided.
    [3]
    3. The method according to claim 1 or 2, characterized in that as the circuit board (1) an IMS printed circuit board (1) is provided.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that the step of producing the cavity (9) comprises milling the circuit board (1) with a milling head (8).
    [5]
    5. The method according to claim 1 or 2, characterized in that as a printed circuit board (1) a printed circuit board (1) is provided from a prepreg material.
    [6]
    6. The method according to claim 5, characterized in that the step of producing the cavity (9) comprises cutting the printed circuit board (1) with a laser beam (15).
    [7]
    7. The method according to any one of claims 1 or 2, characterized in that the circuit board (1) has a over a laser stop patches (16) arranged adhesion-reducing layer (17).
    [8]
    8. The method according to any one of claims 1 to 7, characterized in that a self-adhesive film is applied as a temporary protective layer (7).
    [9]
    9. The method according to any one of claims, characterized in that the self-adhesive film is a polyethylene-based film with a rubber-based adhesive layer.
    [10]
    10. The method according to claim 8, characterized in that the self-adhesive film is a PVC-based film with an acrylate-based adhesive layer.
    [11]
    11. The method according to claim 8, characterized in that the self-adhesive film is a polyethylene-based film having an acrylate-based adhesive layer.
    [12]
    12. The method according to any one of claims 1 to 7, characterized in that as a temporary protective layer (7) a silicone-based paint is applied.
    [13]
    13. The method according to any one of claims 1 to 12, characterized in that the reflector layer (11) is formed from a paint selected from the group consisting of epoxy paints and acrylate paints.
    [14]
    14. The method according to any one of claims 1 to 12, characterized in that the reflector layer (11) is applied as a metal layer of the metals selected from the group consisting of Al, Ag and Rh on the circuit board.
    [15]
    15. The method according to claim 14, characterized in that in addition a layer selected from the group consisting of silica and alumina is applied.
    [16]
    16. The method according to any one of claims 1 to 12, characterized in that the step of applying the reflector layer (11) comprises the following steps: painting the cavity (9) with a gloss lacquer applying a reflective layer of metal to the gloss lacquer applying a protective layer Hexamethylsiloxanbasis on the reflective layer.
    [17]
    17. The method according to any one of claims 1 to 16, characterized in that in the step of producing the cavity (9) distance to existing conductor tracks (4) or bonding surfaces (5) of the printed circuit board (1) is held.
    [18]
    18. Printed circuit board produced by a method according to one of claims 1 to 17.
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
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    法律状态:
    优先权:
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    ATA50058/2014A|AT515372B1|2014-01-29|2014-01-29|Method for producing a printed circuit board|ATA50058/2014A| AT515372B1|2014-01-29|2014-01-29|Method for producing a printed circuit board|
    CN201580016774.6A| CN106165131B|2014-01-29|2015-01-21|Method for producing circuit board|
    US15/115,221| US9713248B2|2014-01-29|2015-01-21|Method for producing a circuit board|
    EP15708697.6A| EP3100310B1|2014-01-29|2015-01-21|Method for producing a circuit board|
    PCT/AT2015/050019| WO2015113088A1|2014-01-29|2015-01-21|Method for producing a circuit board|
    EP21179979.6A| EP3902020A4|2014-01-29|2015-01-21|Circuit board|
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